Shenzhen, China, 18-20 December, 2026 SPCT 2026 site:Click
SPCT Workshop SIEN 2026 Submission site:Click
Call For Papers
The 1st International Workshop on Spatial Intelligence and Embodied Navigation (SIEN2026) will be held in conjunction with the 6th International Conference on Signal Processing and Communication Technology (SPCT2026) on 18–20 December 2026 in Shenzhen, China.
Topics of interest include, but are not limited to:
✧ Spatial intelligence and spatially aware AI agents
✧ Embodied navigation and autonomous mobility
✧ Spatial perception, understanding, and reasoning
✧ World models for navigation and embodied planning
✧ Agentic navigation, task planning, and autonomous decision-making
✧ Recursive Self-Improving, adaptive, and lifelong embodied agents
✧ AI-powered indoor positioning
✧ UAV and low-altitude autonomous navigation
✧ 5G/6G-enabled positioning and navigation
✧ Visual SLAM, 3D scene representation and reconstruction
✧ Multimodal learning and multi-sensor fusion
✧ Collaborative localization, mapping, and navigation for multi-agent systems
✧ Resilient navigation in dynamic and uncertain environments
✧ Cognitive architectures and theories for embodied spatial intelligence
✧ Safety, robustness, and trustworthiness of embodied systems
✧ Datasets and benchmarks for spatial and embodied intelligence
Submission Guide:
Submitted papers must be original work. The paper length is a minimum of 4 pages.
SIEN2026 accepted and presented papers will be published in the SPCT2026 proceedings (via IEEE publication) and submitted for inclusion into EI indexing.
Please submit paper via: Click
SIEN 2026Workshop General Co-Chairs:
Feng Yin, The Chinese University of Hong Kong, Shenzhen, China
Lexi Xu, China Unicom Research Institute, China
Qinglei Kong, Harbin Institute of Technology, Shenzhen, China
Bo Chen, Harbin Institute of Technology, Shenzhen, China
TPC Co-Chairs & Organizers:
Zhansheng Duan, Xi'an Jiaotong University, China
Jian Liu, Harbin Institute of Technology, Shenzhen, China
Huiping Huang, Macau University of Science and Technology
Dong Liu, The Chinese University of Hong Kong, Shenzhen, China
Jiajun He, Queen's University Belfast
Ceyao Zhang, Peking University
Important Dates:
Submission deadline: 30 Oct. 2026
Notification: 10Nov. 2026
Registration: 20 Nov. 2026
More Contact:
E-mail:BDML.zihanyan2@link.cuhk.edu.cn