Workshop 2: SIEN 2026

SIEN2026

Workshop

International Workshop on Computing Power Network Intelligent Operation (SIEN2026)


Shenzhen, China, 18-20 December, 2026              SPCT 2026 site:Click

SPCT Workshop SIEN 2026 Submission site:Click


Call For Papers

The 1st International Workshop on Spatial Intelligence and Embodied Navigation (SIEN2026) will be held in conjunction with the 6th International Conference on Signal Processing and Communication Technology (SPCT2026) on 18–20 December 2026 in Shenzhen, China.


Topics of interest include, but are not limited to:

✧   Spatial intelligence and spatially aware AI agents

✧   Embodied navigation and autonomous mobility

✧   Spatial perception, understanding, and reasoning

✧   World models for navigation and embodied planning

✧   Agentic navigation, task planning, and autonomous decision-making

✧   Recursive Self-Improving, adaptive, and lifelong embodied agents

✧   AI-powered indoor positioning

✧   UAV and low-altitude autonomous navigation

✧   5G/6G-enabled positioning and navigation

✧   Visual SLAM, 3D scene representation and reconstruction

✧   Multimodal learning and multi-sensor fusion

✧   Collaborative localization, mapping, and navigation for multi-agent systems

✧   Resilient navigation in dynamic and uncertain environments

✧   Cognitive architectures and theories for embodied spatial intelligence

✧   Safety, robustness, and trustworthiness of embodied systems

✧   Datasets and benchmarks for spatial and embodied intelligence


Submission Guide:

Submitted papers must be original work. The paper length is a minimum of 4 pages.

SIEN2026 accepted and presented papers will be published in the SPCT2026 proceedings (via IEEE publication) and submitted for inclusion into EI indexing.

Please submit paper via:  Click


SIEN 2026Workshop General Co-Chairs:

Feng Yin, The Chinese University of Hong Kong, Shenzhen, China

Lexi Xu, China Unicom Research Institute, China

Qinglei Kong, Harbin Institute of Technology, Shenzhen, China

Bo Chen, Harbin Institute of Technology, Shenzhen, China



TPC Co-Chairs & Organizers:

Zhansheng Duan, Xi'an Jiaotong University, China

Jian Liu, Harbin Institute of Technology, Shenzhen, China

Huiping Huang, Macau University of Science and Technology

Dong Liu, The Chinese University of Hong Kong, Shenzhen, China

Jiajun He, Queen's University Belfast

Ceyao Zhang, Peking University


Important Dates: 

Submission deadline: 30 Oct. 2026 

Notification: 10Nov. 2026 

Registration: 20 Nov. 2026


More Contact: 

E-mail:BDML.zihanyan2@link.cuhk.edu.cn